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Failure Analysis and Reliability Aspects of Electronic Components

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dc.contributor.author BĂJENESCU, Titu-Marius I.
dc.date.accessioned 2024-06-13T11:43:46Z
dc.date.available 2024-06-13T11:43:46Z
dc.date.issued 2024
dc.identifier.citation BĂJENESCU, Titu-Marius I. Failure Analysis and Reliability Aspects of Electronic Components. In: Electrotehnica, Electronica, Automatica, 2024, vol. 72, pp. 47-57. e-ISSN 2392-828X. en_US
dc.identifier.issn 2392-828X
dc.identifier.uri https://doi.org/10.46904/eea.24.72.1.1108006
dc.identifier.uri http://repository.utm.md/handle/5014/27391
dc.description.abstract Failure analysis (FA) is the process of determining the cause of failure, collecting, and analysing data, and developing conclusions to eliminate the failure mechanism (FM) causing specific device or system failures. Why it is so important to use FA, i.e. to know the cause of product failure, this is what we intend to describe in this article. Reliability analysis is not at all the only ‘customer’ of FA. Other fields, such as business management and military strategy are using this term. In order to offer to the reader a more complete picture, we identified the possible applications of FA in various fields (industry, research, etc.), which are detailed in the article. en_US
dc.language.iso en en_US
dc.publisher INCDIE ICPE-CA Romania en_US
dc.relation.ispartofseries Electrotehnica, Electronica, Automatica (EEA);2024, vol. 72
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject failure analysis en_US
dc.subject reliability en_US
dc.subject failure mechanisms en_US
dc.subject physics of failure en_US
dc.title Failure Analysis and Reliability Aspects of Electronic Components en_US
dc.type Article en_US


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