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Experimental validation of thermal model of MM-Wave frequency multipliers

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dc.contributor.author OPREA, I.
dc.contributor.author COJOCARI, O.
dc.contributor.author SOBORNYTSKYY, M.
dc.contributor.author HARTNAGEL, H. L.
dc.date.accessioned 2021-01-16T11:24:07Z
dc.date.available 2021-01-16T11:24:07Z
dc.date.issued 2013
dc.identifier.citation OPREA, I., COJOCARI, O., SOBORNYTSKYY, M. et al. Experimental validation of thermal model of MM-Wave frequency multipliers. In: 38th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz): proceedings, 1-6 Sept. 2013, Mainz, Germany, 2013, pp. 1-2. ISBN 978-1-4673-4717-4. en_US
dc.identifier.uri https://doi.org/10.1109/IRMMW-THz.2013.6665844
dc.identifier.uri http://repository.utm.md/handle/5014/12467
dc.description Acces full text: https://doi.org/10.1109/IRMMW-THz.2013.6665844 en_US
dc.description.abstract This paper presents a method for estimation of junction temperature of a Schottky diode used in a recently developed frequency doubler to 332 GHz. Our particular interest was the validation of the thermal model of the diode by comparison of the simulated junction temperature with the real junction temperature under operating conditions. RF operating condition is here artificially simulated by dissipating power from DC voltage and current to achieve similar heating effect in the diode. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject Schottky diodes en_US
dc.subject frequency multipliers en_US
dc.title Experimental validation of thermal model of MM-Wave frequency multipliers en_US
dc.type Article en_US


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