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Electrostatically Driven In-Plane Silicon Micropump for Modular Configuration

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dc.contributor.author UHLIG, Sebastian
dc.contributor.author GAUDET, Matthieu
dc.contributor.author LANGA, Sergiu
dc.contributor.author SCHIMMANZ, Klaus
dc.contributor.author CONRAD, Holger
dc.contributor.author KAISER, Bert
dc.contributor.author SCHENK, Harald
dc.date.accessioned 2020-11-24T11:15:11Z
dc.date.available 2020-11-24T11:15:11Z
dc.date.issued 2018
dc.identifier.citation UHLIG , Sebastian, GAUDET , Matthieu, LANGA, Sergiu et al. Electrostatically Driven In-Plane Silicon Micropump for Modular Configuration. In: Micromachines. 2018, Nr. 9, pp. 190. ISSN 2072-666X. en_US
dc.identifier.uri https://doi.org/10.3390/mi9040190
dc.identifier.uri http://repository.utm.md/handle/5014/11711
dc.description Access full text - https://doi.org/10.3390/mi9040190 en_US
dc.description.abstract In this paper, an in-plane reciprocating displacement micropump for liquids and gases which is actuated by a new class of electrostatic bending actuators is reported. The so-called “Nano Electrostatic Drive” is capable of deflecting beyond the electrode gap distance, enabling large generated forces and deflections. Depending on the requirements of the targeted system, the micropump can be modularly designed to meet the specified differential pressures and flow rates by a serial and parallel arrangement of equally working pumping base units. Two selected, medium specific micropump test structure devices for pumping air and isopropanol were designed and investigated. An analytical approach of the driving unit is presented and two-way Fluid-Structure Interaction (FSI) simulations of the micropump were carried out to determine the dynamic behavior. The simulation showed that the test structure device designed for air expected to overcome a total differential pressure of 130 kPa and deliver a flow rate of 0.11 sccm at a 265 Hz driving frequency. The isopropanol design is expected to generate 210 kPa and pump 0.01 sccm at 21 Hz. The device is monolithically fabricated by CMOS-compatible bulk micromachining processes under the use of standard materials only, such as crystalline silicon, silicon dioxide and alumina. en_US
dc.language.iso en en_US
dc.publisher MDPI (Basel, Switzerland) en_US
dc.rights Attribution-NonCommercial-NoDerivs 3.0 United States *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.subject micropumps en_US
dc.subject drives en_US
dc.subject MEMS en_US
dc.subject Micro-Electro-Mechanical Systems en_US
dc.subject pumps en_US
dc.title Electrostatically Driven In-Plane Silicon Micropump for Modular Configuration en_US
dc.type Article en_US


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Attribution-NonCommercial-NoDerivs 3.0 United States Except where otherwise noted, this item's license is described as Attribution-NonCommercial-NoDerivs 3.0 United States

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