Browsing 2020 by Author "BĂJENESCU, Titu-Marius I."

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  • 3D micropackaging of integrated circuits 
    BĂJENESCU, Titu-Marius I. (Tehnica UTM, 2020)
    A major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also, reliability concerns will ...
  • 5G: future opportunities and challenges 
    BĂJENESCU, Titu-Marius I. (Tehnica UTM, 2020)
    5G is the new mobile communications technology which uses the latest techniques to provide a step change in performance, but it also provides some unique challenges. 5G provides the increased speed, bandwidth, low latency ...
  • Challenges of nanotechnologies and some reliability aspects 
    BĂJENESCU, Titu-Marius I.; BÂZU, Marius I. (Tehnica UTM, 2020)
    The article focuses on the analysis of different nanoelectronic architectures with special design rules, taking into account the reliability of the future product. In the next decade, the reliability will play an even ...

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