dc.contributor.author | GRABCO, D. | |
dc.contributor.author | PYRTSAC, C. | |
dc.contributor.author | SHIKIMAKA, O. | |
dc.date.accessioned | 2022-02-04T07:40:58Z | |
dc.date.available | 2022-02-04T07:40:58Z | |
dc.date.issued | 2022 | |
dc.identifier.citation | GRABCO, D., PYRTSAC, C., SHIKIMAKA, O. Relaxation Parameters of Cu/substrate Type Coated Systems Under Nanoindentation. In: 5th International Conference on Nanotechnologies and Biomedical Engineering, ICNBME: proc. IFMBE, 3-5 Nov. 2021, Chișinău, Moldova, 2022, V. 87, pp. 55-61. ISBN 978-3-030-92328-0. | en_US |
dc.identifier.isbn | 978-3-030-92328-0 | |
dc.identifier.uri | https://doi.org/10.1007/978-3-030-92328-0_8 | |
dc.identifier.uri | http://repository.utm.md/handle/5014/19154 | |
dc.description | Acces full text - https://doi.org/10.1007/978-3-030-92328-0_8 | en_US |
dc.description.abstract | In this work, we studied the relaxation parameters, he-p and hres, of three composite structures Cu/LiF, Cu/MgO, and Cu/Si, which have different types of a chemical bond between the substrates (ionic (LiF), ionic-covalent (MgO), and covalent (Si)) and differ in hardness (HCu = 0.6 GPa, HLiF, HMgO and HSi are 1.2, 7.5 and 8.2 GPa, respectively). For each type of substrates, coated systems (CSs) were fabricated with a following Cu film thickness: t1 = 85; t2 = 470 and t3 = 1000 nm. The behavior of relaxation parameters was examined over a wide range of loads, P = 2–900 mN, during nanoindentation. The elastic-plastic parameters were shown to depend on the CS type, as well as on the film thickness and the magnitude of the applied load. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Springer, Cham | en_US |
dc.rights | Attribution-NonCommercial-NoDerivs 3.0 United States | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/us/ | * |
dc.subject | nanoindentation | en_US |
dc.subject | relaxation parameters | en_US |
dc.subject | composite structures | en_US |
dc.subject | coated systems | en_US |
dc.subject | nanoindentation | en_US |
dc.subject | films | en_US |
dc.title | Relaxation Parameters of Cu/substrate Type Coated Systems Under Nanoindentation | en_US |
dc.type | Article | en_US |
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