Impactul conexiunilor verticale asupra ariei in integrarea 3D

Abstract

3D monolithic integration allows more then an alternative for increasing density integration. This offers a new dimension of flexibility in designing integrated circuits, more exactly the ability to devide the project into partitions that can be independetly processed and operated. In the current 2D integration technology, the logical part, memories and the analog functions are processed together and have the same limitations and cost. In a 3D integration each layer can be processed in a optimized flow. In this paper we have integrated a 3D design which contains logical part and memories. We overlap memories on logical part and we present the avantages of 3D integration versus 2D in terms of area.