Browsing by Author "KADEN, C."

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  • Enhancement of vertical integration density by engineered BSOI wafers 
    KADEN, C.; LANGA, S.; LUDEWIG, T.; SCHÖNBERGER, A.; HERRMANN, A.; GÖBEL, A.; KOLKOVSKY, V.; JEROCH, W.; PUFE, W. (Springer Nature Switzerland, 2018)
    The lateral and vertical integration density of bulk microelectromechanical systems (MEMS) using bonded silicon-on-insulator (BSOI) wafers is significantly enhanced if the handle wafer is used as an electrical redistribution ...
  • Wafer level vacuum packaging of micro-mirrors with buried signal lines 
    LANGA, S.; DRABE, C.; HERRMANN, A.; LUDEWIG, T.; RIECK, A.; FLEMMING, A.; KADEN, C. (Springer Nature Switzerland, 2015)
    This paper presents the vacuum wafer level packaging of in-house manufactured two-dimensional micro- mirrors based on the electrostatic driving principle, fabricated using a bulk technology on bonded-silicon-on-insulator ...

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